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Ceramic Products

Overview

Ceramic Products

We are committed to making advances in raising the efficiency and increasing bandwidth in microwave communications devices, as well as developing compactness, speed, and transmission capacity. Now we are aiming to improve and expand even further upon our balanced QCDS.

Technologies

Our single layer chip capacitors (SLC) are made with proprietary formulations of ceramic materials, with a relative permittivity (dielectric constant) ranging in value as low as 40 and high as 50,000. The range of permittivity is classified in accordance with EIA standards for capacitor ceramic dielectrics based on how permittivity is affected by time, temperature, and voltage. Classes 1, 2 and 3 are used for conventional capacitors, and Class 4 for Ultra High-K designs. SLC capacitors are diced from ceramic wafers fabricated to a specified thickness and metallized with or without a designed pattern into predetermined sizes for specific capacitance values. Single layer ceramic chip capacitors used in microwave and optical communications devices are generally die attached to a circuit board or substrate using conductive epoxy or gold-tin solder, and the opposing electrode(s) connected to other elements of the circuit by gold wire or ribbon bonding. Some designs can be entirely surface mounted to eliminate wire connections. The impedance characteristics of single-layer capacitors are superior to multi-layer capacitors for high-frequency bandwidths, and we pride ourselves on producing the designs and performance characteristics sought for high precision applications. A primary goal of our Quality Management System (QMS) is to ensure high reliability by conducting electrical and mechanical testing based on MIL-SPEC standards. Our ceramic products include thin-film metalized circuits on Alumina substrates used in internal matching circuits for microwave devices, and as submounts in optical devices for a number of years. Thin-film chip resistors are used primarily to eliminate noise in optical devices, and we provide them as part of a total chip solution for your microwave or optical device. You can be sure that our ceramic products for high-frequency and optical devices are all RoHS compliant.

Products List

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    Single Layer Chip Capacitors

    Wire bondable, ceramic single layer chip capacitors for high frequency applications.

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    Resistors / Thin Film Chip Resistors

    Chip resistors for impedance matching and noise filtering applications.

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    Resistor Capacitor Networks

    By combining and integrating a capacitor and a resistor on a single ceramic chip made with Tecdia’s Class IV (K=16,000) dielectric material, we help you economize space within your devices and reduce component count.

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    Ground Blocks

    Ceramic Ground Blocks are customizable conductive shims ideal for application within micro-assemblies in both optical and microwave industries.

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    Patterned Alumina Substrates

    Robust miniaturized thin film ceramic build-to-print substrates for RF, Optical and Medical Applications.

Application Notes

Inspection Standards

  • Suitable for a wide range of civil and aerospace systems applications.
  • Three grades of inspection methods: standard, commercial, and custom.
  • Lot sampling for mechanical and electrical inspections, and 100% visual inspection.

Standard Inspections

Conventional Single Layer Chip Capacitors

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Ultra High-K Single Layer Chip Capacitors (Altas®)

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Custom Screening and Testing for Capacitors

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Testing Standards

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Configuration Types

We have three basic types of electrode on chip configurations for capacitors in our line-up, designated as A, B, and C types, which are generally based on the intended method of installation. This provides optimal solutions for the fabrication and usage specifications required by customers.

Type Characteristics

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Type Options for Products

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*1 Customization available regarding external dimensions (length and width), but no custom patterning available.

Guide to Type Selection

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*1 Be careful of shorts due to an excess of bonding material. *2 Contact us to inquire about other solder.

Ceramic Dielectric

Tecdia produces most of the ceramic wafers used to manufacture its capacitors, resistors, and other products using ceramic powders consisting of proprietary titanate (primarily with barium) formulations. A variety of dielectrics are produced from these formulations providing a wide selection of performance characteristics that are classified in accordance with the EIA standard for capacitor ceramic dielectrics.

We separate the products into two categories based on the ceramic manufacturing technology:

i) conventional fine grained ceramics (EIA classes 1,2 & 3)

ii) those made using grain boundary barrier layer (GBBL) technology (EIA class 4 dielectrics).

We also fabricate products using alumina, with 96% or 99.5% purity, based on customer designs. Ceramic products produced by Tecdia provides ample choices to help designers achieve their dreams.

Dielectric Specifications

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* Class 3 dielectrics only used for custom products.

Capacitor Dielectric Data Graphs

Typical Temperature Characteristics

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Typical Aging Characteristics

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Typical DC Bias Characteristics

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Typical Resonance Frequencies

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Packaging & Environment Compliance

Packaging

We provide a variety of packaging options in addition to standard packaging methods.

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Environmental Compliance

Products: RoHS compliant Packaging Materials: Compliant with EU Packaging and Packaging Waste directive

Storage & Application Notes

Storage

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*1 Avoid storing in environments where parts will be exposed to direct sunlight, vibration, impact, corrosive gases, other special gases, freezing condensation, or dust. Never touch parts with bare hands.

*2 Although the product warranty may still be valid, Blue Tape and UV tape packaging has a guaranteed shelf life of 3 months after delivery.

Recommended Installation Conditions and Precautions

Die Attach Conditions

Compatibility with different solders and epoxies vary between products. See the information on product types for more details. Take care to avoid shorts caused by an excess of bonding material at installation. Installation processes can also lead to cracking, so we recommend that users carefully verify conditions.

Recommended Conditions for Wire Bonding

Wire to be used

Au wire: less than 30 um dia.

Bonding  temperature

Wedge bonding: 200 ~ 270℃
Ball bonding: 150 ~ 250℃
We recommend this in conjunction with tool heating.

Bonding methods

Thermocompression bonding and ultrasonic thermocompression bonding.

Precautions

Bond in a location at least 25 um from the edge of the bonding pad.
Also, as bonding acceleration with hard wire, there could damage the front of the ceramic material, or could cause peeling, so we recommend that you understand the installation conditions and make proper adjustments. Option: Using harder wire for high speed bonding increases the risk of damaging metallization adhesion as well as chip cracking due to greater bonding force, so proper adjustments should be made.

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