Ceramic ProductsWe are committed to making advances in raising the efficiency and increasing bandwidth in microwave communications devices, as well as developing compactness, speed, and transmission capacity. Now we are aiming to improve and expand even further upon our balanced QCDS.
TechnologiesOur single layer chip capacitors (SLC) are made with proprietary formulations of ceramic materials, with a relative permittivity (dielectric constant) ranging in value as low as 40 and high as 50,000. The range of permittivity is classified in accordance with EIA standards for capacitor ceramic dielectrics based on how permittivity is affected by time, temperature, and voltage. Classes 1, 2 and 3 are used for conventional capacitors, and Class 4 for Ultra High-K designs. SLC capacitors are diced from ceramic wafers fabricated to a specified thickness and metallized with or without a designed pattern into predetermined sizes for specific capacitance values. Single layer ceramic chip capacitors used in microwave and optical communications devices are generally die attached to a circuit board or substrate using conductive epoxy or gold-tin solder, and the opposing electrode(s) connected to other elements of the circuit by gold wire or ribbon bonding. Some designs can be entirely surface mounted to eliminate wire connections. The impedance characteristics of single-layer capacitors are superior to multi-layer capacitors for high-frequency bandwidths, and we pride ourselves on producing the designs and performance characteristics sought for high precision applications. A primary goal of our Quality Management System (QMS) is to ensure high reliability by conducting electrical and mechanical testing based on MIL-SPEC standards. Our ceramic products include thin-film metalized circuits on Alumina substrates used in internal matching circuits for microwave devices, and as submounts in optical devices for a number of years. Thin-film chip resistors are used primarily to eliminate noise in optical devices, and we provide them as part of a total chip solution for your microwave or optical device. You can be sure that our ceramic products for high-frequency and optical devices are all RoHS compliant.
Wire bondable, ceramic single layer chip capacitors for high frequency applications.
Chip resistors for impedance matching and noise filtering applications.
By combining and integrating a capacitor and a resistor on a single ceramic chip made with Tecdia’s Class IV (K=16,000) dielectric material, we help you economize space within your devices and reduce component count.
Ceramic Ground Blocks are customizable conductive shims ideal for application within micro-assemblies in both optical and microwave industries.
Robust miniaturized thin film ceramic build-to-print substrates for RF, Optical and Medical Applications.
- Suitable for a wide range of civil and aerospace systems applications.
- Three grades of inspection methods: standard, commercial, and custom.
- Lot sampling for mechanical and electrical inspections, and 100% visual inspection.
Conventional Single Layer Chip Capacitors
Ultra High-K Single Layer Chip Capacitors (Altas®)
Custom Screening and Testing for Capacitors
Configuration TypesWe have three basic types of electrode on chip configurations for capacitors in our line-up, designated as A, B, and C types, which are generally based on the intended method of installation. This provides optimal solutions for the fabrication and usage specifications required by customers.
Type Options for Products
*1 Customization available regarding external dimensions (length and width), but no custom patterning available.
Guide to Type Selection
*1 Be careful of shorts due to an excess of bonding material. *2 Contact us to inquire about other solder.
Tecdia produces most of the ceramic wafers used to manufacture its capacitors, resistors, and other products using ceramic powders consisting of proprietary titanate (primarily with barium) formulations. A variety of dielectrics are produced from these formulations providing a wide selection of performance characteristics that are classified in accordance with the EIA standard for capacitor ceramic dielectrics.
We separate the products into two categories based on the ceramic manufacturing technology:
i) conventional fine grained ceramics (EIA classes 1,2 & 3)
ii) those made using grain boundary barrier layer (GBBL) technology (EIA class 4 dielectrics).
We also fabricate products using alumina, with 96% or 99.5% purity, based on customer designs. Ceramic products produced by Tecdia provides ample choices to help designers achieve their dreams.
* Class 3 dielectrics only used for custom products.
Capacitor Dielectric Data Graphs
Typical Temperature Characteristics
Typical Aging Characteristics
Typical DC Bias Characteristics
Typical Resonance Frequencies
Packaging & Environment Compliance
We provide a variety of packaging options in addition to standard packaging methods.
Products: RoHS compliant Packaging Materials: Compliant with EU Packaging and Packaging Waste directive
Storage & Application Notes
*1 Avoid storing in environments where parts will be exposed to direct sunlight, vibration, impact, corrosive gases, other special gases, freezing condensation, or dust. Never touch parts with bare hands.
*2 Although the product warranty may still be valid, Blue Tape and UV tape packaging has a guaranteed shelf life of 3 months after delivery.
Recommended Installation Conditions and Precautions
Die Attach Conditions
Compatibility with different solders and epoxies vary between products. See the information on product types for more details. Take care to avoid shorts caused by an excess of bonding material at installation. Installation processes can also lead to cracking, so we recommend that users carefully verify conditions.
Recommended Conditions for Wire Bonding
Wire to be used
Au wire: less than 30 um dia.
Wedge bonding: 200 ~ 270℃
Ball bonding: 150 ~ 250℃
We recommend this in conjunction with tool heating.
Thermocompression bonding and ultrasonic thermocompression bonding.
Bond in a location at least 25 um from the edge of the bonding pad.
Also, as bonding acceleration with hard wire, there could damage the front of the ceramic material, or could cause peeling, so we recommend that you understand the installation conditions and make proper adjustments. Option: Using harder wire for high speed bonding increases the risk of damaging metallization adhesion as well as chip cracking due to greater bonding force, so proper adjustments should be made.