Patterned Alumina Substrates
- Completely Customizable Plating available from 2.5 to 8μm, and thin-film resistance forming also available.
- Low Transmision Loss High purity (99.5%) reduces loss in high-frequency bandwiths.
- Superior Basic Characteristics Excellent thermal conductivity, electrical insulation, and physical strength characteristics.
- Suitable for both gold-tin soldering and epoxy die attachment.
- Single and multiple value chips, Square and rectangular configurations.
- Inventory of standard designs for quick delivery.