We use advanced manufacturing technologies to make ideal single layer chip capacitors and thin film substrates. Our high capacitance single layer chip capacitors are especially valued in the market.
Our development, design, and manufacture of jigs and fixtures for use in semiconductor manufacturing processes are supported by our backbone of solid experience and skill in machining technologies. Exceptionally high precision dispensing nozzles are a flagship product line.
We make top of the line industrial tools for precision scribing of hard surfaces using diamonds. Our extensive experience and unique expertise in diamond tool technologies allow us to customize products to your needs.
Tecdia’s engineering expertise and manufacturing skill produce scribing and braking machines for semiconductor wafer dicing that are unmatched in the industry.
We produce a variety of components and devices for manufacturers/testers of microwave products that range from cost effective dc bias regulators to state-of-the-art solutions, such as our world renowned high current, broadband bias-t units.
|(December 4, 2013) “Diamond Indenter” and “Diamond Nanoindenter” pages have been added to the Diamond Industrial Products line.
|(November 11, 2013) Cebu Microelectronics Inc (CMI)- Tecdia’s fully owned contract facility located in the Philippines has remained intact following the devastating Haiyan Typhoon. We are fortunate to report our employees and facility are safe and operations are normal.|
|(November 1, 2013) To meet growing business and to further improve our customer service, Tecdia Taiwan office has been relocated from Tao Yuan City to New Taipei City.
|(October 21, 2013) An instructional video has been added to the “Handy Wafer Scriber” page.
|(Jun 1, 2013) To expand our service, Tecdia Japan Headquarters has moved to
new location at 4-3-4 Shibaura, Minato-ku Tokyo.