TECDIA CO., LTD.

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HCT

Ceramic products for high-frequency and optical devices

We use advanced manufacturing technologies to make ideal single layer chip capacitors and thin film substrates. Our high capacitance single layer chip capacitors are especially valued in the market.

Precision Machined Products

Our development, design, and manufacture of jigs and fixtures for use in semiconductor manufacturing processes are supported by our backbone of solid experience and skill in machining technologies. Exceptionally high precision dispensing nozzles are a flagship product line.

Diamond products

We make top of the line industrial tools for precision scribing of hard surfaces using diamonds. Our extensive experience and unique expertise in diamond tool technologies allow us to customize products to your needs.

Semiconductor manufacturing equipment

Tecdia’s engineering expertise and manufacturing skill produce scribing and braking machines for semiconductor wafer dicing that are unmatched in the industry.

Microwave technologies products

We produce a variety of components and devices for manufacturers/testers of microwave products that range from cost effective dc bias regulators to state-of-the-art solutions, such as our world renowned high current, broadband bias-t units.

Oursourcing work

We specialize in contract manufacturing of semiconductor products, including assembly work for optical communications devices. We use our large-scale production bases in the Philippines in order to provide you with the best cost performance.

Latest News

(October 5-10, 2014) Tecdia will exhibit at the 2014 European Microwave Week held at Fiera de Roma in Rome, Italy (Stand 188). This year we will showcase developments in our new HCT (Hybrid Ceramic Technologies) substrate line along with our well known Single Layer Chip Capacitors. Please come by and visit!
http://www.eumweek.com/
(September 22-24, 2014) Tecdia will exhibit at the 2014 ECOC (European Conference on Optical Communications) held in the Palais des Festivals Convention Center located in Cannes, France (Booth 502). This year we will showcase developments in our new HCT (Hybrid Ceramic Technologies) substrate line along with our well known Single Layer Chip Capacitors. Please come by and visit!
http://www.ecocexhibition.com/
(July 22, 2014) Zirconia nozzle has been added to the Precision Machined products line.
http://www.tecdia.com/us/products/precision/dispenser/zro2_nozzle.php
(June 24, 2014) Handy Wafer Scriber has been added to our Solutions section.
http://www.tecdia.com/us/case/11.php
(June 23, 2014) Our Tecdia Inc. (US) office was relocated to Campbell, CA - about 10 miles south of our previous Santa Clara office.
http://www.tecdia.com/us/company/global.php#02
(June 18, 2014) TECDIA Co., Ltd. KOREA has moved to a new location at #704, 303 Hyowon-ro, Paldal-gu Suwon, Gyeonggi-do, Korea 442-835.
http://www.tecdia.com/us/company/global.php#05
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Contact Us Here 03-3988-3500