We use advanced manufacturing technologies to make ideal single layer chip capacitors and thin film substrates. Our high capacitance single layer chip capacitors are especially valued in the market.
Our development, design, and manufacture of jigs and fixtures for use in semiconductor manufacturing processes are supported by our backbone of solid experience and skill in machining technologies. Exceptionally high precision dispensing nozzles are a flagship product line.
We make top of the line industrial tools for precision scribing of hard surfaces using diamonds. Our extensive experience and unique expertise in diamond tool technologies allow us to customize products to your needs.
Tecdia’s engineering expertise and manufacturing skill produce scribing and braking machines for semiconductor wafer dicing that are unmatched in the industry.
We produce a variety of components and devices for manufacturers/testers of microwave products that range from cost effective dc bias regulators to state-of-the-art solutions, such as our world renowned high current, broadband bias-t units.
|(March 5, 2014) Tecdia is proud to release a new webpage with details regarding our new high performance ceramic substrate line, code named HCT. HTC offers engineers unparalleled design flexibility and extremely tight tolerances. Please visit the below website for details.
|(April 16-18, 2014) Tecdia will be exhibiting at the 14th Annual Fiber Optics Expo (FOE2014) at Tokyo Big Sight in Japan. We will showcase contract manufacturing of 100G coherent module devices, brand new ceramic and thin film technologies code named Hybrid Ceramic Technology as well as our Single Layer Ceramic Chip Capacitors. Please come visit us at Booth 21-38!
|(March 19-21, 2014) Tecdia will be exhibiting at the ATEM FAIR 2014, the Adhesive, Coating and Film System Fair at Songdo CONVENSIA, Incheon. We will showcase our products based on precision machine and diamond process technologies at booth #G119.
|(March 11-13, 2014) Tecdia will be exhibiting at the 2014 OFC/NFOEC show in San Francisco, CA. This year we will be showcasing the latest in high performance Lightwave submount design with exotic patterning and 3D shapes. Please visit us in booth 3259!|
|(December 4, 2013) “Diamond Indenter” and “Diamond Nanoindenter” pages have been added to the Diamond Industrial Products line.
|(October 21, 2013) An instructional video has been added to the “Handy Wafer Scriber” page.
|(Jun 1, 2013) To expand our service, Tecdia Japan Headquarters has moved to
new location at 4-3-4 Shibaura, Minato-ku Tokyo.