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A solution for reducing component count in photodetector (PD) devices for optical communication systems that saves space, installation time and cost.
A tutorial on Tecdia's innovative Arque precision dispensing nozzle designed to maintain blend consistency and application accuracy.
Singulation of soft zinc oxide (ZnO) semiconductor wafers can be a difficult challenge. Learn about Tecdia’s solution to make the job easier using special shaped diamond tip scribers.
Semiconductor substrates made with deep groves for the streets between the chips cannot be scribed with standard tool designs. See how Tecdia created a tool to do the job with great results.
Silicon carbide wafers are tough to cut, because they are almost as hard as the diamond used for cutting. The brittle material is also easily chipped. Learn how Tecdia, the scribing specialist, came to the rescue of semiconductor chip manufactures.
Tecdia's unique diamond processing and precision machining techniques produces best-in-class Berkovich diamond Nanoindenters.
A tutorial on Tecdia’s tool setter jig that provides a quick and accurate scriber alignment and machine installation.
Checking the fluid level in big ship tanks can be an extremely difficult task. Tecdia developed the perfect solution using microwave technology and engineering know how.
Tecdia's Bias-Ts not only help repeat a clear picture, but can also be used to enable using the transmission cable to supply electrical power to repeaters in places where a power supply is hard to come by.
