June 1976
Previously named Techtronics, Ltd. The company was founded with capital of ¥1.0 million, taking over all business operations of Koyama Diamond, Ltd. and beginning the manufacture and export of audio components.

September 1976
Established Diamond Fabrication Research Center in Nerima Ward, Tokyo.

May 1977
Succeeded in developing technology for bonding diamonds to other metals.

July 1978
Began development of high frequency electronic components, and increased capitalization to ¥4.0 million.

September 1979
Began wholesale marketing of high frequency electronic components.

October 1979
Established audio product manufacturing assembly line, and set up branch office in Tokorozawa.

October 1979
Succeeded in developing diamond blades and diamond knives. Established new precision machinery fabrication facility at Sakuradai Plant. Changed company name to TECDIA to reflect business expansion.

April 1983
Moved corporate headquarters to current location at Sunshine 60 Building at 3-1-1 Higashi-Ikebukuro, Toshima Ward, Tokyo.

June 1983
Increased capitalization to ¥10.0 million.

December 1985
Established subsidiary under same company name in Silicon Valley, California, USA, and for marketing and distribution of high frequency components.

December 1985
Obtained patents for audio products in the United States, after having previously (in January 1982) received patents in Japan.

July 1987
Because of continued business expansion, the company combined the Sakuradai Plant with Tokorozawa branch office and brought online a new plant in Semayama City.

July 1988
Established subsidiary under same company name in Melbourne, Australia and began the manufacture and marketing of audio products there.

January 1990
Because of continued business expansion, the company completed construction of a new plant in Nishi-Kyo Ward, Kyoto City, and brought the plant online.

July 1992
Increased capitalization to ¥30.0 million.

June 1993
Established new EMS company in Cebu Island Export Zone in The Philippines, and began manufacture of high frequency components.

November 1994
Established microwave technology unit in Japan with the goal of manufacturing high frequency components.

October 1995
Developed and began manufacture of electronic components for use in optical fiber communications.

September 1996
Began construction of second plant in Cebu Island Export Zone in The Philippines.

June 1999
Began marketing new products, including optical communication connectors.

June 1999
Constructed third plant in Cebu Island Export Zone in The Philippines.

June 2000
Established diamond fabrication technology unit with the goal of actively entering the wafer scribing market.

August 2000
Established a new subsidiary under the same company name in Tao Yuan, Taiwan, and began marketing semiconductor components.

August 2001
Established a new subsidiary under the same company name in Suwon, Korea, and began marketing semiconductor components.

December 2001
Transferred Kyoto manufacturing facility to Minami Ward, Kyoto City, and constructed the Kyoto Technology Center.

August 2003
Broke ground on Tokyo Technical Center in Musashi Industrial Park, Irima City, Saitama Prefecture. Precision products division, diamond fabrication technology division, and microwave technology division transferred there from former Sayama Plant.

May 2004
Increased capitalization to ¥60.0 million.

November 2004
Established new subsidiary under same company name in Hong Kong, with the goal of actively participating in the China market.