|
|
|
Diamond Scriber
|
 |
| Q：What
are diamond scriber tools used for?
|
| A：Scribing
is a method to dice chips from semiconductor wafers. It is based on glass
cutting technology, and one of the most prominent dry cutting methods in
use since LED was introduced in the market. |
|
| Q：What
are the characteristics of a diamond scribe?
|
| A：We
incorporate a dry scribe method is which water and heat are
not used. By applying pressure to the interior of the wafer
it creates the micro fracture needed to break the wafer. |
|
| Q：What
is the superiority of diamond scribing method?
|
| A：The
dicing made by breaking tools in the direction of cleavage
leaves a mirror surface, and is most suitable for making chips
from a LED wafer. |
|
| Q：How
do I choose the suitable diamond scriber?
|
| A：It
depends on the material and the thickness of the wafer. Please
check our scriber selection guide (link). |
|
| Q：Do
diamond scriber become dull?
|
| A：Even
a diamond, the hardest material in the world, will dull after
repeated use. Dulled scribers can be re-polished for reuse. |
|
| Chip
Process
|
|
| Q：What
are the applications?
|
| A：Diamond
scribing method is being used for many different applications.
Starting from sapphire wafer for LED applications, it is also
used for many other applications such as LD, FET, MEMS, GaN
FET, Solar Battery , etc. |
|
| Q：:
What is the key design feature of chip process machines?
|
| A：The
most optimized machine design is to provide "everything needed for making chips" with high through put, reliability and long service life. Upon receiving your
requirements, we can give you our design integration suggestions
to optimize your production. |
|
| Q：Do
you do demo's?
|
| A：Yes,
our factory has units setup for demonstrations. |
|
| Q：What
is the equipment line up?
|
| A：We
have the full line up starting from R&D use equipments to master production high volume equipments. |
|
|
