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| We employ advanced high frequency electronic element manufacturing technologies to produce high-performance Regular and Ultra Hi-K single-layer chip capacitors, and thin film circuit substrates. |
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| We develop, design, and manufacture various types of precision production tools and test equipment based on the very latest and most sophisticated fabrication technologies. |
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| Our wide range of diamond application technology based products is renowned the world over, especially our diamond scribing tools and devices. |
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| TECDIA's other products, such as microwave, lightwave and the others. |
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(January 18 – 20, 2012) Tecdia will be exhibiting at the 41st INTERNEPCON exhibition in Tokyo, Japan - Asia’s largest exhibition for electronics manufacturing. We will be showcasing our Arque product line of Ultra Precision Dispensing
Nozzles, Custom Dispensing solutions, and more!
http://www.nepcon.jp/en/ |
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(November 30 – December 2, 2011) Tecdia will be exhibiting at the MWE2011 in Yokohama, Japan. We will be showcasing
our standard ceramic and “ALTAS” Ultra Hi-K Single Layer Capacitors, Alumina Substrates, Chip Resistors and our broadband, high current Bias-T’s.Please visit us in booth# E302!
http://apmc-mwe.org/mwe2011/index_e.html |
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Tecdia Korea has out grown its current office space and will be moving into a larger suite within the same building. Effective August 8, they will be located in Samho Park Tower Room 307 in Suwon.
http://www.tecdia.com/us/company/global.html#ko |
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（August 18, 2010）Product information: New fully automatic 6-inch wafer breaking machine (TEC-1228AL) has been released.
For more information, please check
http://www.tecdia.com/us/product/diamond/break_1228al.html |
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