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Home > Product Information > Diamond Products > Characteristics of Scribe Cutting
Diamond Products
Characteristics of Scribe Cutting
Scribe Tool Selection
Introduction to Scribe Tools
Scribing Machine
For 3-inch wafer
Full-auto for 4-inch wafer
Semi-auto for 4-inch wafer
For 12-inch wafer
For 6-inch wafer
For 4-inch wafer
Breaking Machine
Full-auto for 4-inch wafer
Full-auto for 6-inch wafer
Semi-auto for 4-inch wafer
Bonding Machine
 

Characteristics of Scribe Cutting

Dry Process

Ideal for wafers affected by wafer solubility and static electricity.
Glass Wafer
Silicon Wafer
Sapphire LED before
Dicing & Breaking

Improved Yield

Typical scribe cut width is 2～5 μm which enables higher wafer yields.

 

Dicing Fracture Control

Scribe cutting is a method that utilizes stress upon the diamond scribing tool to create a micro-fracture within the wafer. To control the fracture it is essential to choose the appropriate scribing tool.

Scribe Line Analysis (TD-2P)		  
Side View
of scribe cut method

Side View of
laser cut method