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Diamond Products
Characteristics of Scribing cutting
Scribing tool selection
Introduction to scribing tools
scribing Machine
For 3-inch wafer
Full-auto for 4-inch wafer
Semi-auto for 4-inch wafer
For 12-inch wafer
For 6-inch wafer
For 4-inch wafer
Breaking Machine
Full-auto for 4-inch wafer
Full-auto for 6-inch wafer
Semi-auto for 4-inch wafer
Bonding Machine
 

Scribing Machine

12-inch wafer Compatible Machine

TEC-5600DD

Capable to apply up to 12-inch ultra thin wafer.tions

1. scribing machine which is suitable for 2nd generation large diameter ultra thin wafer.
2. Air controlled tool scribe
Unlike in a spring method, in an air suspension method a fixed load can be set without being influenced by cutting depth it also reduces the risk of jumping.
3. Porous Chuck Table
By using a porous chuck when securing working surfaceto the table a uniformed suction can be applied to make a clean scribe possible.
4. Linear servo motor
The machine is equipped with a linear servo motor for more precise scribing by minimizing vibration in the driving side.

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