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Characteristics of Scribing cutting
Scribing tool selection
Introduction to scribing tools
Scribing Machine
For 3-inch wafer
Full-auto for 4-inch wafer
Semi-auto for 4-inch wafer
For 12-inch wafer
For 6-inch wafer
For 4-inch wafer
Breaking Machine
Full-auto for 4-inch wafer
Full-auto for 6-inch wafer
Semi-auto for 4-inch wafer
Bonding Machine
 

Scribing Machine

6-inch wafer Compatible Machine
TEC-5000HS

Applicable to a wide range of wafers from 2" to 6"

1. Air ride and linear servo used on work axis to achieve high-precision scribing.
2. Easy to use, capable of mass production without problems.
3. Compatible with wide range of applications from 2-inch to 6-inch.
4. Utilizes porous chuck that enables uniform attachment to the entire work surface, resulting in high-quality scribing.

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