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High-rigidity and high-power peeling system
| 1. |
High Throughput, Rigid Design
Quick setup time increases wafer processing yield.
Independent feeding and camera shafts eliminate vibration in high-speed operations,
yielding clean scribing lines. |
| 2. |
Auto Alignment
Unique imaging system recognizes bar array instantly.
On fragmented wafers, individual chips can also be identified independently. |
| 3. |
Pneumatic controlled tool scribe
Unlike spring loaded designs, air suspension provides even scribing pressure,
reducing unwanted jumping. |
| 4. |
Linear Servomotor
Each machine is equipped with a linear servo motor that minimizes vibration. |
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