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Diamond Products
Characteristics of Scribing cutting
Scribing tool selection
Introduction to scribing tools
Scribing Machine
For 3-inch wafer
Full-auto for 4-inch wafer
Semi-auto for 4-inch wafer
For 12-inch wafer
For 6-inch wafer
For 4-inch wafer
Breaking Machine
Full-auto for 4-inch wafer
Full-auto for 6-inch wafer
Semi-auto for 4-inch wafer
Bonding Machine
 

Scribing Machine

4-inch wafer Compatible Machine

TEC-6000RS

The installed upper and lower cameras have
improved image perceiving properties,

1. Image processing capabilities make device usable for LD chip scribing.
2. XY stage with linear servo on stone surface plate base produces high-precision positioning performance.
3. Simultaneous X-axis and Y-axis control specification supported for scribing height direction shape.
4. High precision, efficiency and durability at an affordable price.

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