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Characteristics of Scribing cutting
Scribing tool selection
Introduction to scribing tools
Scribing Machine
For 3-inch wafer
Full-auto for 4-inch wafer
Semi-auto for 4-inch wafer
For 12-inch wafer
For 6-inch wafer
For 4-inch wafer
Breaking Machine
Full-auto for 4-inch wafer
Full-auto for 6-inch wafer
Semi-auto for 4-inch wafer
Bonding Machine
 

Scribing Machine

3-inch wafer Compatible Machine

TEC-2004TM

Ideal initial equipment for R&D and educational institutions

1. Air controlled tool scribe
Unlike in a spring method, in an air suspension method a fixed load can be set without being influenced by cutting depth it also reduces the risk of jumping.
2. Hi-Rigidity design
Processor and conveyor axis mechanisms are separated and directly fixed to the body of the machine. The advantages of this feature can be seen when cutting hard materials like sapphires.
3. High Throughput
Camera and conveyor axis are installed separately, which makes it possible to view the working conditions without stopping the operation. The coupling of the processor and eccentric axes creates a stop motion free cycle. Both features shorten production time dramatically.
4. Porous Chuck Table
By using a porous chuck when securing working surfaceto the table a uniformed suction can be applied to make a clean scribe possible.

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