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Diamond Products
Characteristics of Scribe Cutting
Scribe Tool Selection
Introduction to Scribe Tools
Scribing Machine
For 3-inch wafer
Full-auto for 4-inch wafer
Semi-auto for 4-inch wafer
For 12-inch wafer
For 6-inch wafer
For 4-inch wafer
Breaking Machine
Full-auto for 4-inch wafer
Full-auto for 6-inch wafer
Semi-auto for 4-inch wafer
Bonding Machine
 

Introduction to Scribe Tools

TD-3YGP
For SiC, Sapphire Wafers

TD-3P
For Semiconductor Wafers
(InP, etc.)
TD-4PB
For Semiconductor Wafers
(Si, etc.)
TD-420
For Semiconductor Wafers
(GaAs, etc.), Glass Wafers
TD-2P
For Semiconductor Wafers
(Semi-Custom)
TD-8P
For Developmental Use
(Semi-Custom)

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