|
|
|
Custom Products
Suitable for plating from 2.5μm to 8μm. Fully customized product, also available in a thin-film resistor format.
Suitable for a wide range of custom designs. |
| Key Features |
- Since 99.5% pure alumina is used, loss is least found in the high-frequency range.
- These are high-quality alumina thin-film circuit boards with excellent themal conductivity, strength, as well as insulation properties.
- Shorter delivery time due to standardization in the company.
|
| Applications |
- High-frequency I/O boards
- High-frequency Circuit Boards
- Telecommunications Equipment Circuit Boards
|
| 1. Basic Properties of Materials |
| Alumina Content |
99.5% Alumina (±0.1%) |
| Substrate Size |
2"×2"(50.8×50.8mm) |
| Substrate Thickness |
Sintering: |
0.254mm ±20% |
| 0.381mm ±15% |
| 0.635mm ±10% |
Lapped and
polished mirror surface |
As per customer's request |
| Standard Surface Roughness |
Sintering: |
0.20μm Ra |
| Lapped |
0.38μm Ra |
| Polished Mirror Surface |
0.025μm Ra |
| 2. Film composition |
| Electrode film: |
TiW-NiCr-Au |
| TaN-TiW-NiCr-Au |
| Thickness of Golden Film: |
As per customer's request |
| 3. Resistive Film |
| Tantalum Nitride: |
50O/sq ±20% after heat treatment (as per customer's request) |
| TCR: |
-50 ±100 ppm/℃ |
| 4. Minimum Chip Size |
| 0.4mm × 0.4mm Min. |
| 5. Electrode pattern |
| Minimum Pad Size |
Length: 0.10mm Min. |
| Width: 0.10mm Min. |
| Lines & Gaps |
Lines: 0.05mm Min. |
| Gaps: 0.05mm Min. |
| Pattern, Area |
 |
| 6. Pattern of Resistance |
| Width: 0.10mm Min. |
| Length: 0.05mm Min. |
| 7. Plated through holes |
| Minimum Diameter of the Hole |
Diameter of the Hole: Substrate Thickness |
1 : 1 |
 |
| Miminum Tolerance |
± 0.05mm |
| Pitch between the Through Hole |
 |
Minimum electrode size
around the through holes |
Hole diameter + 0.5mm min. |
| Minimum distance from the edge of the through hole to the substrate edge |
 |
| 8. Data Format |
| DXF or DWG |
Quality Assurance Guide
| Wire Bonding Test |
MIL-STD-883F M2011 |
| Die-shear Test |
MIL-STD-883F M2019 |
| Thermal Resistance Test |
400℃ x 5 minutes |
|
