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C-Type Standard Products
| Electrodes without borders have platinum below the gold. This allows them to withstand high die attachment temperatures for longer periods of time than two-layer (TiW/Au) electrodes. The platinum also acts as a strong barrier against solder. Thus, widens the selection options related to the attachment with platinum and further increases the attachment strength and reliability. |
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| Features |
- Suitable for automated assembly
- Most economical design
- Good solderability (Au/Si, Ge, Sn or Sn/Pb)
- Maximum capacitance for physical size
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