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Single-Layer Capacitors
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Single-Layer Chip Capacitors

Ceramic Technology

The capacity value of the Tecdia single-layer chip capacitors is decided by cutting very thin ceramic wafers having dielectric constants of 40 - 30,000 into various shapes and sizes. These ceramic wafers (dielectrics) are classified into industry standard classes (1, 2, 3, 4) according to changes in characteristics depending on temperature.

Single-layer chip capacitors are normally used in high-frequency striplines and high-frequency circuit boards that operate at frequencies over 1GHz. They are generally die-bonded with conductive epoxy or Au/Sn solder and are connected to the package or circuit board by gold wire bonding.
The shapes are constructed with straight, perpendicular edges and 90‹corners. It comes with two types. In one type, the electrode covers the entire upper and lower sides of a ceramic board. Another is the border type, which comes with outer part framed.

Quality and high reliability are assured by electrical, mechanical and environmental testing based on MIL-Spec.
Inspection of these capacitors is performed in clean room. They are packaged in waffle packs, usually 100 per pack.
Please note that these products require special handling and storage conditions to maintain quality.




For products used in the aerospace industry and other high-reliability systems, special screening tests can also be performed depending on the customer's needs.

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