Home > Product Information > High Frequency Ceramic Products > Single-Layer Chip Capacitors > Type - Single Electrode Capacitor - Gap Capacitor - Binary Capacitor - Multi-Pad Capacitor - Custom Design Capacitor   Single Electrode Capacitor (with borders & without borders) Gap Capacitor Binary Capacitor   Multi-Pad Capacitor Custom Designs All the design types (A, B&C) are made with the same dielectric materials and basic production processes except for their electrodes. All the electrodes use TiW as the bottom layer, which provides both strong adhesion to the ceramic and a diffusion barrier layer. Tecdia® has used this metallization for many years, and it has now become widely used in the industry because of its superior properties. The top layer for all electrodes is gold (100 micro-inches minimum). Platinum is used between the gold layer and TiW on electrodes without borders. Both metallization schemes provide excellent electrode to ceramic adhesion strength and attachment of gold wire with standard wedge bonding techniques.