・Suitable for a wide range of civil and aerospace systems applications.
・Three grades of inspection methods: standard, commercial, and custom.
・Lot sampling for mechanical and electrical inspections, and 100% visual inspection.
Standard Inspections
Conventional Single Layer Chip Capacitors
| Characteristics |
Each Capacitor |
Each Wafer Lot |
Each Production Lot |
| Visual |
Standard |
6 sides |
|
AQLⅡ(1.0%) |
| Commercial |
4 sides |
|
AQLⅡ(1.0%) |
| Electrical |
Capacitance |
|
|
AQLⅡ(1.0%) |
| Dissipation Factor |
|
|
AQLⅡ(1.0%) |
| Insulation Resistance |
|
10(0) |
|
| Dielectric Withstanding Voltage (DWV) |
|
10(0) |
|
| Mechanical |
Bond Pull |
|
3(0) |
|
| Die Shear |
|
3(0) |
|
| High Temperature Resistance (400℃) |
|
5(0) |
|
| Dimension Check |
L , W , t |
|
3(0) |
|
Ultra High-K Single Layer Chip Capacitors (Altas®)
| Characteristics |
Each Capacitor |
Each Wafer Lot |
Each Production Lot |
| Visual |
4 sides |
|
AQLⅡ(1.0%) |
| Electrical |
Capacitance |
|
|
AQLⅡ(1.0%) |
| Dissipation Factor |
|
|
AQLⅡ(1.0%) |
| Insulation Resistance |
|
|
AQLⅠ(0.15%) |
| Dielectric Withstanding Voltage (DWV) |
|
10(0) |
|
| Mechanical |
Bond Pull |
|
3(0) |
|
| Die Shear |
|
3(0) |
|
| Temperature Resistance (400℃) |
|
5(0) |
|
| Dimension Check |
L , W , t |
|
3(0) |
|
Custom Screening and Testing for Capacitors
| MIL-C-49464/MIL-PRF-49464/MIL-C-55681 |
| MIL-PRF-38534, Table C-Ⅲ ,Level H&K |
| MIL-PRF-123 |
| Customer Specification |
Testing Standards
| Parameters |
Conditions |
| Temperature Cycling |
MIL-STD-883/Method 1010 Cond.A/B/C (-65～150℃) |
| Thermal Shock |
MIL-STD-202/Method 107 Cond.A/B/F (-65～150℃) |
| Voltage Conditioning |
MIL-STD-883/Method 1015 Cond.A/B/C/F |
| Capacitance & DF |
MIL-STD-202/Method 305 |
| Insulation Resistance (IR) |
MIL-STD-202/Method 302 |
| Dielectric Withstanding Voltage (DWV) |
MIL-STD-202/Method 301 |
| Bond Pull Strength |
MIL-STD-883/Method 2011 Cond.D |
| Die Shear Strength |
MIL-STD-883/Method 2019 (3000g max.) |
| Temperature Characteristics |
EIA-198/Method 105 (-85～140℃) |
| Immersion |
MIL-STD-202/Method 104 |
| Resistance to Solder Heat |
MIL-STD-202/Method 210 Cond.A/B/C/D |
| Moisture Resistance |
MIL-STD-202/Method 106 |
| Life |
MIL-STD-202/Method 108 less than or (150℃ max.) |
| Humidity (steady state) |
MIL-STD-202/Method 103 (Max.85℃×95% RH) |
| Constant Acceleration |
MIL-STD-883/Method 2001 Cond.A/B/C/D/E/F/G/H, Y1 (100KG max.) |
| Vibration |
MIL-STD-202/Method 201 |
| High Frequency Vibration |
MIL-STD-202/Method 204 Cond.A/B/C/D(2kHz, 20G max.) |
| Variable Frequency Vibration |
MIL-STD-883/Method 2007 Cond.A |
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