We have three basic types of electrode on chip configurations for capacitors in our line-up, designated as A, B, and C types, which are generally based on the intended method of installation. This provides optimal solutions for the fabrication and usage specifications required by customers.

Type Characteristics

Type Characteristics	A	B	C
View
Electrode Design	Border on top face	Border on both faces	Border on neither face

Type Options for Products

Product Line			Standard Designs					Custom Design
			Single Value			Multi Value
			A	B	C	A	B
Single Layer Chip Capacitor			◯	◯	◯	◯	◯	◯
Ultra High-K Chip Capacitors （ALTAS®) K30000					◯			◯*1
Ultra High-K Chip Capacitors （ALTAS®) K16000					◯	◯		◯
Integrated Resistor-Capacitor (IRCTM)			◯					◯
Thin Film Chip Resistors			◯					◯
Patterned Alumina Substrates								◯

*1 Customization available regarding external dimensions (length and width), but no custom patterning available.

Guide to Type Selection

Type	Product Line	Metallization			Wire bondability	Die bonding
						Solder	Epoxy
						(AuSn, other*2)
A	Single Layer Chip Capacitor	Top	TiW/Au		◯		◯
		Bottom	TiW/Pt/Au		◯	◯	◯
	Ultra High-K Row Capacitor	Top	TiW/Au		◯		◯
		Bottom	Ti/Pt/Au		◯	◯	◯
	Integrated Resistor-Capacitor	Top	TaN/TiW/Au		◯		◯
		Bottom	Ti/Pt/Au		◯	◯	◯
	Thin Film Chip Resistor	Top	TaN/TiW/Au		◯		◯
		Bottom	TiW/Pt/Au		◯	◯	◯
	Patterned Alumina Substrates	Top	(TaN)/NiCr/Au		◯	◯	◯
		Bottom	NiCr/Au		◯	◯	◯
B	Single Layer Chip Capacitor	Top	TiW/Au		◯		◯
		Bottom	TiW/Au		◯		◯
	Patterned Alumina Substrates	Top	(TaN)/NiCr/Au		◯	◯	◯
		Bottom	(TaN)/NiCr/Au		◯	◯	◯
C	Single Layer Chip Capacitor	Top	TiW/Pt/Au		◯	◯	◯*1
		Bottom	TiW/Pt/Au		◯	◯	◯*1
	Ultra High-K Single Layer Chip Capacitor (Altas®)	Top	Ti/Pt/Au		◯	◯	◯*1
		Bottom	Ti/Pt/Au		◯	◯	◯*1
	Patterned Alumina Substrates	Top	NiCr/Au		◯	◯	◯
		Bottom	NiCr/Au		◯	◯	◯

*1 Be careful of shorts due to an excess of bonding material.
*2 Contact us to inquire about other solders.

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