Wafer Breaking Equipment
Fully Automatic Wafer Breaking Machine for 6-inch Wafers
(Model No.: TEC-1228AL)
Fully automatic breaking, the next generation.
- Standardized for 6-inch wafers
- Break detection function
- High efficiency wafer transport system
- Accurate image recognition functions
Can also be used for wafers from 2 to 4 inches by changing the break blade and work table.
Eliminates secondary breaking errors.
Double-armed transport shortens wafer loading time.
The clarity of the machine’s optical system reduces matching errors in image recognition.
Top Face Light System
|Add effective top face lighting to deal with wafers that are difficult to see when only illuminated from the bottom face.|
Magnetic Hammer Unit
|This unit supports breaking that is difficult to accomplish with normal breaking operations.|
Dimensions (width × depth × height) / weight
1516mm × 862mm × 1506mm / 650kg