Wafer Scribing Equipment
Manual Wafer Scribing Machine for 3-inch Wafers
（Model No.: TEC-2004TM）
Design influenced by Tecdia’s scribing tool manufacturing expertise.
- Air controlled scribing
- Solid design for hard work
- High Efficiency Separating the camera axis from the machining axis, means the work-piece can be monitored without stopping scribing operation, saving a lot of downtime.
- Excellent Scribe Stability
Using air pressure to apply a fixed stress load on the scribing tool simplifies controlling cutting depth, eliminating problems with variations in depth associated with spring suspension methods. Air suspension also reduces the risk of tool jumping.
The machining axis and feed axis mechanisms are separate from each other, and attached directly to the body. The effect of this solid construction becomes evident when scribing very hard materials such as sapphire.
The machine’s porous chuck table provides consistent suction across the entire surface of the work-piece for cleaner scribing.
Diamond Scribing Tools
|Tecdia’s master crafted designs are available for a wide selection of applications.|
|We supply jigs that will help you save preparation time and easily find cutting points.|
Dimensions (width × depth × height) / weight
670 mm × 850 mm × 1300 mm / 370 kg