Wafer Scribing Equipment
Semi Automatic Wafer Scribing Machine for 4-inch Wafers
（Model No.: TEC-2005RM）
High speed and high quality. A definitive wafer scribing machine.
Features
- Designed for high rigidity and high throughput
- Auto-alignment function
- Tools pressurized by air control
- Linear servo motors
The machining axis, feed axis and camera axis are all independent of one another. By eliminating vibration and blurring when used at high speeds, you can get neat and clean scribe lines without compromising speed, allowing you to have high throughput.
Tecdia's original image recognition system allows bulk recognition of bar arrays, and is also equipped with a wafer fragment mode, which can recognize a single chip.
In addition to enabling cutting with a fixed load that eliminates the variation in depth that comes with spring suspension methods, air suspension also has the effect of nearly eliminating tool jumping.
We've made scribing more precise than ever by using linear servo motors on the drive side to reduce vibration.
Accessories
Diamond Scribing Tools |
Tecdia’s master crafted designs are available for a wide selection of applications. |
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Tool Setters |
We supply jigs that will help you save preparation time and easily find cutting points. |
Dimensions (width × depth × height) / weight
750mm × 930mm × 1560mm / 700kg
